TY  - GEN
AU  - Lingaraju M MDS11M004
AU  - 
TI  - Metal foam heat transfer for cooling electronic devices
U1  - 536.2:621.38 LIN 
PY  - 2013///
CY  - IIITDM Kancheepuram
PB  - Dept of Mechanical Systems
KW  - Metal foam, heat transfer, electronic devices
N1  - M.Des - Theses
ER  -